Layout for a typical electronics manufacturing production assembly line will have either one continuous flow two-sided (SMT top and bottom) SMT line or, two half-SMT PCB assembly lines (top and bottom).
This will be followed by a through-hole wave-solder process, manual electronics assembly, ICT, FVT, mechanical assembly (systems integration/box build) then, systems functional testing.
Planning capacity
Taking planning capacity into consideration, below assumes manual and mechanical portions of the process may be staffed sufficiently to meet needed product or process cycle time (takt) and, the main driver for capacity is the SMT equipment.
SEE ALSO
Improving SMT PCB assembly line productivity
How to improve electronics manufacturing product quality
Surface mount assembly line configuration
Depending on OEM program requirements or contract EMS provider needs, standard machine/equipment setup for most electronics production lines usually follows (except where otherwise noted below):
- Screen printer
- Solder paste in-line inspection
- SMT pick and place (chip shooters – 2?)
- Fine pitch placement machine
- Re-flow oven (forced convection)
- Manual assembly line (2nd ops)
- Wave solder
- In-circuit testing (ICT)
- Functional verification test (FVT)
- System functional test area
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